KONDUCT® conductive polymer compounds, masterbatches and additives are developed for thermal management, electrical conductivity, static dissipation and EMI/RFI shielding. Formulations can be developed in thermoplastics, silicone and rubber, with thermal, electrical, mechanical and processing properties tailored to the finished application.
Thermally and electrically conductive polymers can provide functionality traditionally associated with metals while retaining many of the processing and design advantages of plastics. Depending on the application, they can reduce weight, simplify manufacture, integrate several functions into a single component and allow geometries that would be difficult or expensive to produce in metal.
The suitability of a conductive polymer depends on the required thermal, electrical, mechanical and environmental performance, so material selection should always be based on the finished component rather than conductivity alone.
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Conductive polymers can replace aluminium, steel or other metallic components where the required thermal, electrical or shielding performance can be achieved with a polymer system.
This can reduce component weight and remove issues such as corrosion, while retaining the ability to mould complex shapes. Metal replacement is application-dependent, however, and should be assessed against the complete performance requirements of the part.
A conductive polymer can provide more than structural functionality. Depending on the formulation, the same material can combine thermal conductivity, electrical conductivity, static dissipation or EMI/RFI shielding with the mechanical properties required by the component.
This can reduce the need for separate conductive coatings, metallic inserts, heat spreaders or shielding layers.
Injection moulding and extrusion allow conductive polymers to be formed into complex geometries, thin sections, integral features and shapes that may require several manufacturing operations when produced in metal.
This can be particularly valuable where thermal or electrical functionality needs to be incorporated directly into housings, connectors, enclosures or other moulded components.
Replacing metallic elements with conductive polymers can reduce component mass, which may be important in automotive, aerospace, portable electronics and other weight-sensitive applications.
Integrating conductive functionality directly into a moulded part can also reduce the number of separate components and assembly operations, potentially simplifying the overall design and manufacturing process.
KONDUCT® thermally conductive plastics are developed to transfer and dissipate heat while retaining the processing, weight and design advantages of polymer materials. Formulations can be tailored for applications ranging from heat sinks and electronic housings to lighting, battery systems and automotive components, with thermal performance balanced against the mechanical, electrical and processing requirements of the finished part.
Materials can be developed to provide thermal conductivity while remaining electrically insulating, or to combine thermal and electrical conductivity where both properties are required. Because thermal performance depends on much more than a single conductivity value, KONDUCT® compounds are formulated around the geometry, processing method and heat-flow requirements of the actual application.
Increasing the thermal conductivity of a polymer requires the creation of efficient pathways through which heat can travel. This is typically achieved using thermally conductive fillers, but filler type, loading, particle geometry and distribution can all influence the behaviour of the finished material.
KONDUCT® formulations are therefore developed around the required balance of thermal conductivity, mechanical properties, density, surface finish and processability, rather than simply maximising a headline conductivity value.
Depending on the application, thermally conductive compounds can be developed for:
Transferring heat away from electronic components, LEDs, batteries, motors or other heat-generating devices without relying solely on metallic heat sinks.
Providing an effective thermal pathway while maintaining electrical isolation. This is particularly useful around electronic and electrical components where heat must be removed without creating an electrically conductive path.
Where the polymer is required to conduct both heat and electricity, allowing a single material to provide thermal management alongside grounding, electrical continuity or EMI/RFI shielding.
Replacing aluminium or other metallic components where the required thermal performance can be achieved with a mouldable polymer, potentially reducing weight, simplifying component geometry and consolidating multiple parts.
Thermal imaging provides a fast, visual way to assess how effectively heat moves through a material or component. Using FLIR thermal imaging, we can monitor surface temperature in real time and compare the way different KONDUCT® formulations distribute, retain and dissipate heat under controlled conditions.
This is particularly useful during formulation development, where apparently small changes in filler type, loading or processing can produce visible differences in heat flow. Thermal video can also reveal hot spots, uneven heat distribution and differences in heating or cooling rate, helping us understand how a compound is likely to behave in a real component rather than relying solely on a single material-property value.
FLIR imaging can be used alongside laboratory thermal-conductivity measurements to compare candidate formulations, investigate component geometry and demonstrate thermal behaviour in a clear, visual form.
Thermal conductivity in filled polymers is often directional. During injection moulding or extrusion, conductive fillers can become oriented by the flow of the molten polymer, producing significantly different conductivity along the plane of the component compared with through its thickness.
For this reason, a single thermal conductivity figure does not always provide a useful indication of how a material will perform in a finished component.
KONDUCT® materials can be evaluated for both in-plane and through-plane thermal performance, allowing the formulation and processing conditions to be considered alongside the direction in which heat actually needs to travel.
This is particularly important for thin-wall housings, heat spreaders and components where the principal heat-flow direction differs from the polymer flow direction.
Many thermal-management applications require effective heat transfer without electrical conductivity. KONDUCT® formulations can incorporate electrically insulating ceramic and mineral filler systems to increase thermal conductivity while maintaining electrical isolation.
These materials can be useful in electronic housings, LED components, electrical equipment, battery systems and other applications where conventional conductive fillers such as graphite or metals would introduce an unwanted electrical pathway.
The formulation can be adjusted around the required combination of thermal conductivity, dielectric behaviour, mechanical performance and processing characteristics.
The thermal performance of a polymer component depends on more than the conductivity of the material itself. Component thickness, surface area, contact resistance, heat-source location, airflow, filler orientation and processing conditions can all influence the rate at which heat is transferred.
A material with a higher quoted conductivity will therefore not necessarily produce a better-performing component if the heat-flow path, geometry or processing conditions are poorly matched to the formulation.
For this reason, we consider the finished component and thermal pathway during material development rather than treating thermal conductivity as an isolated material property.
KONDUCT® technology can be supplied as a fully compounded polymer, concentrated masterbatch or custom additive system depending on the base polymer, processing method and performance required.
Thermally conductive formulations can be developed in a range of thermoplastics and elastomers, including polyamide (PA/nylon), polypropylene (PP), polycarbonate (PC), PBT/PET, TPU, silicone and other engineering polymers.
Formulation, compounding and development are carried out in-house, allowing filler systems, loading levels and processing behaviour to be rapidly adjusted during development.
Thermal performance can be evaluated in-house using flash analysis to measure thermal diffusivity and determine thermal conductivity. Where appropriate, samples can be assessed in both in-plane and through-plane orientations to identify the effects of filler orientation and processing.
Testing can be combined with mechanical, electrical and processing evaluation so that improved thermal conductivity is not achieved at the expense of other critical properties.
Small-scale compounding and moulding also allow new formulations to be developed and evaluated before progressing to commercial manufacture.
We use a NETZSCH LFA 447 NanoFlash system to evaluate the thermal performance of KONDUCT® materials in-house. Flash analysis measures thermal diffusivity — how quickly heat travels through a material — from which thermal conductivity can be determined using the material’s density and specific heat capacity.
Testing processed samples rather than relying only on raw-material data is particularly important with filled polymers. Conductive fillers can become oriented during injection moulding or extrusion, creating significant differences between in-plane and through-plane thermal conductivity.
By testing materials during development, we can compare formulations, quantify the effects of filler type and loading, investigate processing-induced anisotropy and optimise the balance between thermal conductivity and other requirements such as mechanical properties, electrical behaviour and processability.
This in-house capability also shortens the development cycle: formulations can be compounded, processed, measured and modified without sending samples away for routine thermal analysis.
KONDUCT® EMI/RFI shielding compounds are developed to reduce the transmission of unwanted electromagnetic and radio-frequency interference into or out of electronic components and enclosures. Conductive polymer systems can provide shielding performance while retaining the weight, corrosion resistance and design freedom of plastics, making them suitable for applications where conventional metallic shielding is impractical or unnecessarily heavy.
Shielding performance can be tailored through the choice of conductive filler, loading level, polymer system and component design. Depending on the application, KONDUCT® materials can be formulated for electronic housings, sensors, communications equipment, automotive electronics and other components where electromagnetic compatibility and interference control are critical.
Effective shielding reduces the amount of electromagnetic energy transmitted through a component. In conductive polymer systems, this is achieved through a combination of reflection, absorption and multiple internal reflections within the material.
The relative contribution of each mechanism depends on the electrical conductivity of the compound, filler type and distribution, component thickness, frequency range and geometry of the finished part.
For this reason, shielding performance cannot be judged from electrical resistivity alone. The material, component design and operating frequency all need to be considered together.
EMI/RFI shielding performance can be introduced using a range of conductive filler technologies, including carbon-based and metallic systems.
Each filler type offers a different balance of electrical conductivity, shielding effectiveness, density, mechanical performance, surface finish and processability. The optimum formulation therefore depends on both the required shielding level and the wider requirements of the component.
KONDUCT® compounds are developed around the finished application rather than around a fixed filler system, allowing electrical, mechanical and processing properties to be adjusted together during development.
EMI/RFI shielding performance is commonly expressed as shielding effectiveness in decibels (dB). The required level of attenuation depends on the sensitivity of the equipment, the strength and frequency of the interference, and the regulatory or performance requirements of the application.
Shielding effectiveness can vary significantly across different frequency ranges, so a material that performs well at one frequency may not provide the same attenuation at another.
Where shielding performance is critical, the compound should therefore be assessed under conditions that are representative of the final application rather than relying on a single headline conductivity or shielding value.
Conductive polymer compounds can allow shielding functionality to be incorporated directly into a moulded component rather than added as a separate metallic enclosure, foil, coating or conductive layer.
This can potentially reduce component weight, simplify assembly and enable more complex geometries, while also avoiding corrosion issues associated with some metallic shielding systems.
Whether a conductive polymer can replace a conventional metal shield depends on the required attenuation, component geometry, frequency range and mechanical demands of the application.
In some applications, EMI/RFI shielding is required alongside electrical conductivity or thermal management.
KONDUCT® materials can be developed to combine electrical conductivity, EMI/RFI attenuation and thermal conductivity within a single polymer system where the application requires it.
The formulation can then be balanced around the most important performance criteria, such as shielding effectiveness, resistivity, heat dissipation, stiffness, density or processability.
KONDUCT® shielding technology can be supplied as a fully compounded conductive polymer, concentrated masterbatch or custom additive system depending on the polymer, processing method and level of shielding required.
Formulations can be developed in a range of thermoplastics and elastomers, with the filler system selected according to the required electrical behaviour, shielding performance and processing conditions.
Because formulation, compounding and development are carried out in-house, materials can be adjusted rapidly during development to refine conductivity, processability and the other properties required by the finished component.
EMI/RFI shielding performance is influenced by both the material and the design of the finished component. Material development should therefore consider conductivity, filler distribution, wall thickness, frequency range and component geometry alongside the required shielding effectiveness.
Electrical testing can be used during development to confirm that the required level of conductivity has been achieved, while further shielding evaluation can be carried out where application-specific attenuation data is required.
Small-scale compounding and test-piece moulding allow new formulations to be evaluated and refined before progressing to commercial manufacture.
KONDUCT® electrically conductive plastics can be formulated across a wide range of electrical resistance, from antistatic and static dissipative materials through to highly conductive compounds. This allows the electrical behaviour of the polymer to be matched to the requirements of the finished component, whether the objective is controlled electrostatic discharge, charge dissipation, electrical continuity or EMI/RFI shielding.
Conductivity can be introduced into thermoplastics, silicone and rubber using carbon-based, metallic and other conductive filler systems. The most appropriate technology depends on the required resistivity, base polymer, processing method, mechanical properties, colour and operating environment.
Increasing conductivity is not simply a matter of adding more conductive filler. Filler type and loading can affect flow behaviour, strength, stiffness, surface finish, density and processability, while the moulding or extrusion process itself can influence the conductive network formed within the polymer.
For this reason, KONDUCT® compounds are formulated around the finished application rather than to a predetermined additive loading. We consider the target surface or volume resistivity alongside the polymer, component geometry, processing conditions and required mechanical properties.
Where necessary, formulations can also be developed to provide a combination of electrical conductivity, thermal conductivity, mechanical performance and EMI/RFI shielding within the same material.
KONDUCT® technology can be supplied as a fully compounded conductive polymer, concentrated masterbatch or custom additive system depending on the polymer, processing method and level of control required.
Conductive formulations can be developed in a wide range of thermoplastics and elastomers, including polyamide (PA/nylon), polypropylene (PP), polyethylene (PE), polycarbonate (PC), ABS, POM, TPU, PET/PBT, silicone and rubber.
Because formulation, compounding and development are carried out in-house, materials can be rapidly adjusted and re-tested to optimise conductivity, processing behaviour and the other properties required by the application.
Electrical resistance is measured during development to confirm that the required conductive or static-dissipative range has been achieved. Testing can be combined with mechanical, thermal and processing evaluation so that electrical performance is not achieved at the expense of other critical material properties.
Small-scale compounding and test-piece moulding allow new formulations to be evaluated before progressing to commercial manufacture, helping to shorten development cycles and reduce the amount of material required for initial trials.
Electrical performance in polymers covers a broad range. Some applications require only enough conductivity to prevent the accumulation of static charge, while others require controlled dissipation of electrostatic energy or a much lower-resistance electrical pathway.
KONDUCT® materials can therefore be developed for:
Designed to allow electrostatic charge to dissipate in a controlled manner rather than discharge suddenly. This is particularly important around sensitive electronic components, assemblies and manufacturing environments where uncontrolled electrostatic discharge could cause damage.
Static dissipative polymer compounds provide a controlled pathway for electrostatic charge to dissipate, reducing the risk of sudden discharges that could damage sensitive electronic components or interfere with manufacturing processes. Surface and volume resistance can be tailored to the requirements of the application.
Conductive polymer compounds provide a relatively low-resistance electrical pathway through or across a moulded component. Applications include grounding, electrical continuity, conductive contacts and charge transfer, where conventional insulating plastics would be unsuitable.
Conductive polymer compounds developed to attenuate electromagnetic and radio-frequency interference by reflecting and/or absorbing incident electromagnetic energy. These materials can be used in housings, enclosures and other components where electronic systems need protection from external interference or where emitted interference must be contained.
The required electrical resistance is established at the start of the development process so that conductivity can be balanced against the mechanical, processing and aesthetic requirements of the component.
In many applications, replacing aluminium or copper heatsinks with conductive plastics can increase production speed and reduce costs without compromising performance.
The ability to mould housings and casings from thermally conductive, electrically insulating plastics allows heat dissipation to be improved when use alongside, or even in place of, conventional metallic solutions.
The rapid acceleration of electric vehicle adoption has brought with it an increased demand for thermal management solutions and weight reduction.
KONDUCT® materials are developed in-house from initial formulation through compounding, testing, optimisation and scale-up. This allows us to work from the performance requirements of the finished component rather than selecting the nearest available grade from a fixed range.
Conductive polymer development often involves balancing several competing properties. Increasing electrical or thermal conductivity can affect flow, stiffness, strength, density, surface finish and processability, while the processing method itself can influence filler orientation and the conductive network formed within the polymer.
By keeping formulation, compounding, test-piece production and material evaluation in-house, we can adjust each of these variables rapidly and assess the results under controlled conditions.
Development starts with the requirements of the component: the base polymer, required electrical or thermal performance, operating environment, processing method, geometry and any mechanical, dimensional or aesthetic constraints.
From there, we select the most appropriate conductive system and determine the required balance of properties. Depending on the application, this may involve carbon-based, metallic, ceramic, mineral or hybrid filler systems.
The objective is not simply to achieve the highest possible conductivity. It is to achieve the required conductivity while maintaining acceptable processing and end-use performance.
New KONDUCT® formulations can be compounded in small batches using our in-house development equipment, allowing different filler types, loading levels and additive combinations to be evaluated without committing to full-scale production.
Materials can then be processed into plaques, test specimens or application-relevant samples for evaluation.
This makes it possible to move quickly through successive formulations and identify promising combinations before scale-up. It also reduces the amount of material required during early-stage development and allows problems to be identified before commercial production.
Testing is integrated into the development process rather than treated as a final-stage check.
Depending on the application, we can evaluate properties including surface and volume resistivity, thermal diffusivity, thermal conductivity, mechanical behaviour, processing characteristics and thermal performance under imaging.
Processed samples are particularly important with conductive polymers because moulding and extrusion can alter filler distribution and orientation. Measuring the properties of the actual compounded and processed material therefore provides more useful information than relying only on supplier data for individual fillers or base polymers.
The results from each trial are fed directly back into formulation development.
Filler type, loading level, polymer grade and supporting additives can be adjusted to refine conductivity while also improving properties such as flow, strength, stiffness, density, surface quality or dimensional stability.
This iterative approach is particularly important where several functions must be combined in a single material, for example thermal conductivity with electrical insulation, or electrical conductivity with EMI/RFI shielding and mechanical performance.
Once the required balance of properties has been demonstrated, the formulation can be transferred into commercial production.
Because development and manufacture are carried out within the same organisation, there is no separate handover from a technology supplier to an external compounder. Formulation knowledge, processing history and test data remain part of the same development process.
KONDUCT® materials can ultimately be supplied as fully compounded polymers, concentrated masterbatches or custom additive systems, depending on the application and preferred manufacturing route.
We can develop conductive materials for completely new components or reformulate existing polymer systems where greater thermal conductivity, electrical conductivity, static dissipation or shielding performance is required.
Projects can begin from a performance brief, an existing polymer grade, a current component or a target property profile. This makes the development process suitable for both new product design and incremental improvement of established materials.
Yes. Thermal conductivity and electrical conductivity are separate properties, and polymers can be formulated to transfer heat while remaining electrically insulating.
KONDUCT® materials can use ceramic, mineral or other electrically insulating thermal fillers to create a conductive heat pathway without introducing an unwanted electrical path. This is useful in applications such as electronic housings, LED components, battery systems and electrical equipment.
Thermal conductivity depends on the polymer, filler system, filler loading, processing method and direction of heat flow. Filled polymers can achieve substantially higher thermal conductivity than the unmodified base resin, but the most appropriate target is application-specific rather than simply the highest possible W/m·K value.
KONDUCT® formulations can currently achieve up to approximately 20 W/m·K in-plane and 2.5 W/m·K through-plane, depending on the polymer and formulation. These values should be considered alongside component geometry, filler orientation and processing conditions.
In-plane conductivity describes heat flow along the plane of a moulded or extruded component, while through-plane conductivity describes heat flow through its thickness.
The two values can differ significantly in filled polymers because processing can orient conductive fillers within the material. For this reason, we can evaluate KONDUCT® materials in both directions where the heat-flow path in the finished component makes this relevant.
These terms describe different ranges of electrical resistance.
Antistatic materials are designed to reduce static charge accumulation. Static dissipative or ESD materials allow charge to dissipate in a controlled manner, reducing the risk of sudden electrostatic discharge. Electrically conductive materials provide a much lower-resistance electrical pathway and can be used where grounding, electrical continuity or higher levels of conductivity are required.
The appropriate range depends on the application and should be specified before formulation begins.
Yes. Electrically conductive polymers can be formulated to attenuate electromagnetic and radio-frequency interference through a combination of reflection, absorption and internal interactions within the material.
Shielding performance depends on factors including electrical conductivity, filler type, component thickness, frequency range and geometry, so EMI/RFI performance should be considered as part of the overall component design rather than from resistivity alone.
A wide range of thermoplastics and elastomers can be modified to provide electrical conductivity or static-dissipative behaviour.
Depending on the application, KONDUCT® formulations can be developed in materials including PA/nylon, PP, PE, PC, ABS, POM, TPU, PET/PBT, silicone and rubber. The most appropriate conductive technology depends on the base polymer, required resistivity, processing method and mechanical requirements.
Many engineering thermoplastics and elastomers can be formulated for improved thermal conductivity.
KONDUCT® thermally conductive systems can be developed in materials including PA/nylon, PP, PC, PBT/PET, TPU, silicone and other engineering polymers, depending on the operating temperature, processing method and required balance of thermal, mechanical and electrical properties.
Conductive fillers can influence more than conductivity. Depending on their type and concentration, they may affect flow behaviour, stiffness, strength, density, impact resistance, surface finish, shrinkage and processing conditions.
For this reason, KONDUCT® materials are developed around the complete property requirements of the finished component. Conductivity is optimised alongside mechanical performance and processability rather than treated as an isolated target.
Yes. KONDUCT® technology can be supplied as a fully compounded conductive polymer, concentrated masterbatch or custom additive system, depending on the application and manufacturing route.
Fully compounded materials provide the greatest control over formulation and final properties, while masterbatch or additive systems may be appropriate where the customer wishes to retain control of the final polymer conversion process.
Yes. Development can begin from an existing polymer grade, current component, target specification or performance brief.
We can modify the material to introduce or improve properties such as thermal conductivity, electrical conductivity, static dissipation or EMI/RFI shielding, while considering the need to retain mechanical, processing or aesthetic characteristics of the original material.
Yes. Electrical and thermal testing are integrated into KONDUCT® development.
We can measure properties including surface and volume resistivity, while thermal performance can be evaluated using in-house NETZSCH flash analysis and FLIR thermal imaging. Where appropriate, processed samples can also be assessed for in-plane and through-plane thermal behaviour, helping us understand how formulation and processing affect the finished material.
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